Product - Signal
Signal
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
| Item | Capabilities | |
| Number of Layers | Single-side ; Double Side; Multi-layer (4~22 Lay) | |
| Material | 1. CEM-1, FR-2, FR-1 XPC-94HB 2. FR-4,CEM-3,HighTg, Aluminum, Halogen Free 3. 4 to 22 layers(FR-4, High Tg, Rogers) | |
| PCB Thickness | Min.thickness | 0.2mm(8mil) |
| Max.thickness | 3.2mm(128mil) | |
| Surface finished | Gold Plating | |
| Immersion Gold(Silver) | ||
| HAL Lead Free | ||
| Hot Air Solder Leveling(HASL) | ||
| Entek Coating (OSP) | ||
| Solder Mask | Green,White,Black,Yellow,Red,Blue | |
| Other printing | Gold Finger | |
| Carbon Print, Peelable Mask | ||
| Solder Mask Plugged Hole | ||
| Copper thickness | 0.5oz, 1oz, 2oz, 3oz,4oz 1/ 2 oz (18 μm) - 4 oz (140 μm) | |
| Min. Finished Hole Size | 0.3mm(12mil) | |
| Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
| Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
| Min. Line Width and Spacing | 0.10mm (4 mil) | |
| Min. Solder Mask Clearance | 0.076mm (3 mil) | |
| Min. Annular Ring | 0.1mm (4mil) | |
| Profile and V-Cut | CNC-Routing, Stamping and Beveling,V-CUT,CNC | |
| Special Process | Micro-section, Chamfer for Gold Finger | |
