Product - TOP-SIM03
TOP-SIM03
ATTEND SIM CARD Socket, Push-Push Type, 6+2 pin, 10U", REEL packaging 115A-ADA0-R02
Brand : Attend
ATTEND part number: 115A-ADA0-R02
TOP part number: TOP-SIM03
Material:
Housing: LCP+30% GF, UL 94V-0 RATED,
Color: black
Contacts: copper alloy
Shield cover: sus304 , 0.2T
Pitch: 1.27mm
Height above the board: 1.8mm
Plating:
Contact area: head cold plating over 1.27um (50um) MIN, nickel under plating
Soldering zone: 3.05 um(120um) min, 100% TIN, or lead-free plating
shield cover: gold flash nickel under plating
under plating: 1.27um (50um)min nickel allover
cutting burr allowed: 0.03mm MAX.
THE DIMENSIONS MARKED WITH “II” are critical dimensions.
Co planarity is 0.10mm MAX.
RoHS compliant products.
Specification
|
Insulator Material |
L.C.P.+30% Glass Filled,UL94V-0 |
|
Color: |
Black |
|
Name |
SIM Card Socket Push-Push Type for 6Pin |
|
Contact Area Plated |
10u" Gold Plated Over 50" Nickel |
|
Pitch |
1.27mm |
|
Height above the board |
1.8mm |
|
Solder Area Plated |
100u" Tin Plated Over 50u" Nickel |
|
Current Rating |
0.5A AC/DC Max. |
|
Insulation Resistance |
1000 M ohm Min initial. |
|
Dielectric Withstanding Voltage |
500V for 1 minute |
|
Insertion Cycles |
10,000 Cycles Min |
Feature:
Electrical
1. Current rating: 0.5A per pin
2. Voltage rating: 30v AC/DC
3. Contact resistance: 30mΩ
4. Insulation resistance : 1000MΩ
5. Withstanding voltage: 500 VAC
Mechanical
1. Durability: 5000 cycle
Environmental
1. Operating temperature range: -40°C ~ +85°C
2. Storage temperature range: -40°C ~ +85°C
3. Solder ability: recommended IR reflow temperature: 260°C 10Sec.
All materials are RoHS compliance
Application:
l GSM APPLICATIONS
l POINT OF SALE TERMINALS
l PERSONAL SMART CARD DEVICES
l MOBILE PHONES
l PORTABLE DEVICES
Drawing:
